Leading the topic of the “Complementary Chips for Thermopile Sensors†undertaken by the Mixed Signal Analog IP team of the Specialized Integrated Circuits and Systems Research Room (Second Room) led by the Integrated Circuit Pilot Technology R & D Center (Room 10) of the Institute of Microelectronics, Chinese Academy of Sciences Analog front-end and high-precision temperature sensor chip testing. Test results show that the chip has reached a high level in function and performance, and it is currently the first high-performance special integrated circuit chip for thermopile applications in China.
In recent years, with the continuous advancement of infrared sensing technology, the non-refrigerated thermopile infrared detector made by micro mechanical system (MEMS) technology has low energy consumption, light weight, compact size, short warm-up time and cost Low-profile advantages have attracted much attention. And because its manufacturing process is compatible with the standard CMOS process, the structure is simple and reliable, and it is easy to be monolithically integrated with the peripheral signal processing circuit, it has become a research hotspot in the industry and scientific research units.
Under the planning guidance of Researcher Hei Yong, Director of the Second Room, the simulation IP project team composed of Associate Researchers Hu Xiaoyu, Fan Jun, and Chen Chengying conducted research on the key technologies of the supporting chips surrounding the thermopile, and successfully completed the low noise and low offset simulation in this topic Front-end and high-precision temperature sensor chip development. Test results show that the performance of this chip has reached the domestic first-class level. The low-noise and low-offset analog front-end uses chopper technology, including low-noise and low-offset operational amplifiers and high-precision Sigma-Delta analog-to-digital converters. The test results show that the effective detection accuracy of the chip reaches 9bit, and the linearity change of the analog front-end amplification gain is only 4.5% in the temperature range of -40 ~ 125 ℃. In the design of high-precision temperature sensors, the project team fully considered non-ideal factors such as operational amplifier offset, BJT mismatch, current mirror mismatch, BJT process error, and back-end quantization circuit offset. The average control measurement idea, combined with BJT gain nonlinear correction, device mismatch correction and other technologies, finally completed the design. Through the incubator test, the temperature sensor is in the range of 20 ~ 125 ℃, and the detection accuracy is controlled within ± 0.1 ℃.
At present, the project team has focused on breaking through some key technologies of low-noise and low-offset analog front-end, and on this basis, further explore the single-chip integration technology of high-performance thermopile sensors, laying the foundation for the development and industrialization of high-performance infrared sensor supporting chips A good foundation.
Thermopile analog front-end chip and effective accuracy test results
High-precision temperature sensor chip
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